Chinese scientists find a new way to heat the chip, the maximum power is increased by 2 to 4 times

2019-03-21

For the people nowadays, the smart phone manpower has become the most common "landscape". Even some people use a lot of mobile phones, work, life, plus a game, but Even so, I still feel that the phone is not enough. A very important reason is that the phone is running too fast! The power consumption of the mobile phone is too fast. A very important reason is that the energy consumption of the mobile phone CPU chip is too high. This is why many manufacturers try their best to improve the design and optimize the energy consumption of the chip.



 

An external feedback of high CPU power consumption is the heat dissipation problem of the chip. High-speed operation leads to a lot of heat (heat source is the power conversion), and in order to dissipate this heat, it also needs to use some brains. The computer, plus a CPU fan, turns to take away the heat, the space of the mobile phone is too small, and it is not allowed to have such a "occupied place" design, which has always been a problem.



 

Fudan University team successfully developed a conformal hexagonal boron nitride dielectric substrate modification technology, which is expected to provide a new solution to solve the chip heat dissipation problem.



 

As an important advance in the field of interface modification of FET dielectric substrates, thanks to the potential characteristics of hexagonal boron nitride in the field of interface heat dissipation, in the traditional hexagonal boron nitride preparation method, the current carrier transfer process will produce more The gap is prone to impurities and defects, which is not conducive to heat dissipation. However, the conformal hexagonal boron nitride does not have such a defect. The conformal hexagonal boron nitride can be attached to the surface of the material without gaps, which does not occur. Impurities are mixed in, which reduces the thermal resistance of the interface, and the heat dissipation efficiency also increases the maximum power density of the device by 2 to 4 times.



 

It is worth mentioning that some people feel that their mobile phones have been hot for a long time. In fact, many of them are not caused by the heat generated by the CPU, but caused by the heat of the battery. However, if the temperature of the CPU is too high, it will affect the mobile phone. The speed of operation, and this time about the emergence of new CPU cooling technology, may bring a revolutionary discovery to the stability of the CPU, not sure that one day, the chip will never overheat in the calculation.



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